Surface Mount Electronic PCB Assembly

Surface Mount Technology

ESD's flexible surface mount assembly equipment allows placement of fine pitch components ranging from 0201 to µBGAs. ESD's automated SMT assembly production lines include a MPM screen printer, fine pitch placement machines, a modern air reflow oven and AOI (Automated Optical Inspection) equipment.

Customers are welcome to free-issue some or all component parts or pcbs for their Printed Circuit Board assemblies, whilst ESD's experienced purchasing team uses established local & global suppliers to procure the balance required. We hold a large stock of standard components and can advise which of these are on your bom if you prefer to part-source.

Our surface mount technologies include reflow profiling to ensure maximum yields and joint integrity. ESD offers Paste or glue techniques in our manufacturing portfolio. Our Automated Optical Inspection (AOI) machine inspects surface mount assemblies, reducing operator fatigue.

ESD's electronics assembly production facility operates in a controlled ESD environment. Once programmed the fully automated machines allow total flexibility, enabling ESD to supply low to high production quantities.



Customers can prove their designs using ESD's PCB assembly prototype service. This service includes the PCB and component sourcing and assembly. We will give feedback on the PCB layout in terms of design for manufacture on request.


At ESD we are able to process a number of PCB materials, from flexible PCBs, to standard FR4 and Aluminium boards. We can work with very small PCBs upto approximately A3 in size (and occasionally larger). Single and Double sided PCBs. Please contact us for more details.

How Does SMT Assembly Work?

A layer of paste is applied to the PCBs using a paste stencil. The PCB then goes through a pick and place machine. This machine is loaded with all the components for the specific electronic assembly. The robot inside the machine picks each specified component, identifies it and places it in the programmed location. The PCB is then placed on a conveyor which then goes through a reflow oven. This oven cooks the PCB and components at a programmed temperature and speed according to the PCB material and components.

Prior to the first run of a PCB assembly the thermal profile of the Reflow oven is created. The profile is optimised to the requirements of the individual components and PCB properties. Profiling is used to ensure maximum yields and joint integrity for each smd assembly.

Advantages of Surface Mount Technology

Surface mount technology produces electronic circuits where components are mounted directly onto the surfaces of the PCB. Surface mount devices are generally smaller than through-hole counterparts because they have either smaller leads or no leads at all.

  • Smaller components with higher density
  • Low initial cost and production time
  • Surface Mount Technology emits low radiated emissions
  • Simpler and faster Surface Mount Assembly process, reducing both time and cost
  • Any minor errors in the component placement are automatically amended
  • Quality mechanical performance under vibration conditions.
  • The PCB can be smaller than for an equivalent through hole circuit
  • Components can be placed on either side of the PCB
  • Fewer holes need to be drilled in the PCB
  • Surface Mount Technology produces reliable, high-frequency performance.

What our customers say:

  • "Maintain the high quality you produce... good production delivery times."
  • "Happy with the way ESD tried to improve the products they have supplied"
  • "very pleased with the service & dealings we have as a new customer"
  • "pleasure to do business with" (ESD)
  • "We are very happy with our relationship and the work done by ESD"

If you wish to find out more about ESD surface mount assembly services or receive a quote, please get in touch with us using the form on our contact page or alternatively, telephone us and a member of our staff will be happy to assist you.